Physical electronics devices and ics miscellaneous


Physical electronics devices and ics miscellaneous

Physical Electronics Devices and ICs

  1. Metal used in the metallization of CMOS circuits is—









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    NA

    Correct Option: D

    NA


  1. Photoetching is a process of—









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    Photoetching is a process of selective removal of a layer

    Correct Option: A

    Photoetching is a process of selective removal of a layer



  1. In monolithic IC fabrication process—
    (i) All compounds are fabricated on single crystal of silicon
    (ii) Any value of capacitors and resistors can be fabricated
    (iii) Each transistor is diffused into separate isolation region
    (iv) Common process for different devices are carried out together









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    NA

    Correct Option: D

    NA


  1. Basic function of SiO2 is—
    (i) Physical strength
    (ii) Isolation
    (iii) Passivation from external contaminants
    (iv) Electrical connection
    (v) Selective diffusion









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    The Basic function of SiO2 is
    * Isolation
    * Passivation from external contaminants
    * Selective diffusion

    Correct Option: C

    The Basic function of SiO2 is
    * Isolation
    * Passivation from external contaminants
    * Selective diffusion



  1. The substrate in a monolithic circuit must be connected to—









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    The substrate in a monolithic circuit must be connected to most negative voltage for p-type substrate

    Correct Option: C

    The substrate in a monolithic circuit must be connected to most negative voltage for p-type substrate